18 October 2010

SEMICON Japan 2010 (Makuhari Messe)

In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our latest polishing technologies in this SEMICON Japan.

Our exhibition will include:

• Flattening system most suitable for prime silicon wafers
  For the current and future demands about productivity and quality of prime silicon wafer planarization, SpeedFam introduces the latest series of lapper, polisher and edge polisher.
• Dry Etcher (DCP)
  DCP (Dry Chemical Planarization) is our numerically controlled flattening system. DCP enables non-contact, zero distortion processing by vapor phase chemical etching reaction of plasma. DCP provides precise thickness control for Si layer of SOI, SOS, SOG wafer as well as prime wafer planarization.
• Polisher demonstration
  Actual polishers are exhibited at our booth. SpeedFam proposes the advanced process with the newest polisher for ultra thin quartz crystal wafer and polisher for sapphire wafer.
• Cleaner
  SpeedFam introduces automated cleaner for PV (photovoltaic) wafer and precision cleaner for various kinds of materials such as quartz crystal and sapphire wafer.
• Leading edge consumables
  We put an important emphasis on the development of consumables and accompanying parts, as well as support for the total improvement of all processes.

SpeedFam exhibits the lineup which support up and coming demands for next generation productions.
Please be sure to visit us.

Session: 1-3 December 2010

Meeting place: Makuhari Messe

Booth No: 2D-801

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• Reference:
• SpeedFam
• sfinfo@speedfam.com