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2 October 2012

SEMICON Japan 2012 (Makuhari Messe)

In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our advanced solutions of surface creation of latest polishing and cleaning technologies in this SEMICON Japan.
Our exhibition will include:
  • Flattening system most suitable for prime silicon wafers
    For 450mm prime silicon wafer planarization, SpeedFam introduces the latest series of polisher and edge polisher as well as the most suitable consumables.
  • Solutions for sapphire and SiC wafers
    SpeedFam introduces its advanced systems for large size sapphire wafer for LED, and various material wafer including SiC and GaN.
  • Edge metrology system demonstration
    Actual Edge Profiler of Yuhi Technology is exhibited at our booth. Edge Profiler enables efficient quality control and yield enhancement of edge grinding process by measurement of edge and notch profiles of sapphire wafer, etc.
  • Cleaner
    SpeedFam introduces automated cleaner for PV (photovoltaic) wafer and precision cleaner for various kinds of materials such as quartz crystal and sapphire wafer.
SpeedFam exhibits the lineup which support up and coming demands for next generation productions.
Please be sure to visit us.
Session: 5-7 December 2012
Meeting place: Makuhari Messe
Booth No: 5A-513