The SpeedFam double side polisher DSM20B-5P-4D is a polisher developed to meet 200mm and 300mm silicon wafer requirements for the highest degree of flatness. The handling of five 300mm wafers per batch capability is the most suitable for automation. The degree of flatness and roll-off management in a stable mass production environment is already realized in major silicon wafer manufacturing plants around the world.
We also offer processing carriers which are indispensable and necessary for high degrees of flatness. Our diamond dressing carriers and equipment design add to the ease of process maintenance and repeatability.