SpeedFam continues to develop original products as a pioneer of planar abrasion equipment and meets the expectations of our visitors. We exhibit "SpeedFam pursuing Surface Creation (creation of an aspect) limitlessly" as the theme in this SEMICON Japan. These words express the SpeedFam target to aim at limitlessly pursuing flatness and planarity.
Our exhibition products will include:
- Edge Polisher for Devices (EPD)
EPD is an extension of our edge polishing process to improve die yields during the fabrication of patterned silicon wafers. Our visitors will understand how we can maximize IC production and yield at various process nodes including front end and back end of line steps.
- The flattening system most suitable for future 300mm silicon wafers
In conjunction with our double side lapper and polisher, we can achieve the minimization of nanotopography and roll off in bare silicon wafer manufacturing. We also introduce our single side polisher and edge polisher, and our leading edge DCP (dry planarization system) for bare silicon wafer.
- The DSM-V series combines the best tolerances for highest quality manufacturing.
An actual DSM-10.5B machine will be exhibited. Our type V series of equipment is the most stable platform for mass production of large, thin wafers (oxides and crystals). It is a core technology for overwhelmingly and highly precise devices. DSM-V series is applicable to various material applications.
- Advanced consumable materials and new products
We put an important emphasis on the development of consumables and accompanying machined parts, as well as support for the total improvement of all processes.
Our lineup exhibits SpeedFam products which support up and coming demands for next generation products and services. Please visit us.
Session: From 7 to 9 on December 2005
Meeting place: Makuhari Messe
Booth No: 2A -605