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Aug 15, 2010 : Opening of U.S. Facility in Buffalo Grove, Illinois
Jun 30, 2010 : IMTS 2010 (McCormick Place)
Apr 05, 2010 : Japan Welding Show 2010 (Tokyo Big Sight)
Feb 11, 2010 : BATTERY JAPAN (Tokyo Big Sight)
Sep 15, 2009 : Laser division transferred to SpeedFam
Sep 01, 2009 : New President of SpeedFam
Aug 15, 2009 : SEMICON Japan 2009 (Makuhari Messe)
Jan 06, 2009 : FC EXPO 2009 (Tokyo Big Sight)
Sep 08, 2008 : Subsidiary name change
Aug 15, 2008 : SEMICON Japan 2008 (Makuhari Messe)
Sep 14, 2007 : SEMICON Japan 2007 (Makuhari Messe)
Aug 15, 2007 : SEMICON Europa 2007 (Stuttgart)
Apr 09, 2007 : Subsidiary establishment in Korea
Aug 15, 2006 : SEMICON Japan 2006 (Makuhari Messe)
May 25, 2006 : IMTS 2006 (McCormick Place)
Mar 01, 2006 : Increase of polisher production capacity
Dec 25, 2005 : Increase of precision cleaner production capacity
Nov 01, 2005 : Opening of Shenzen Service Station
Aug 15, 2005 : SEMICON Japan 2005 (Makuhari Messe)
Jul 04, 2005 An introduction of double side polisher for 300mm, 200mm silicon wafers
Jun 30, 2005 : Flat Chaser to efficiently measure flatness of lapping plates and polishing pads
Jun 27, 2005 : An introduction to double side lapper of 300mm silicon wafers
Sep 01, 2004 : Cancellation of European and American sales agency contract
Oct 25, 2002 : Edge Polisher introduction to patterned/device wafer applications
Sep 07, 2000 : Guidance of new life SpeedFam
Apr 12, 2000 : Release of double side lapper/polisher DSM22B-6L/P for glass disks |
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