SpeedFam continues developing epoch-making processes and equipment.

Dry Chemical Planarization (DCP) is our numerically controlled flattening system. DCP enables non-contact, zero distortion processing by vapor phase chemical etching reaction of plasma. This system was specially developed to eliminate wafer damage from charge-up by applying down stream plasma. DCP is extremely precise and utilizes an optimized original numerically controlled program to realize the most stabile processing. Applications include high end semiconductor-related requirements for the next generation flatness specifications. DCP can easily process large diameter parts in excess of 300mm. This clean and dry process also ameliorates production environments.