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As precision lapping and polishing requirements become more severe we offer the highest quality consumables including slurrys, abrasives, carriers, pads, and plates for a wide range of applications including silicon, glass, compound semiconductors, ceramics, metals and more. We confidently suggest and provide the best consumable sets based on decades of experience.

Please contact us to discuss your specific consumable requirements in detail.

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Edge Mirror 6
EM6 is our specially formulated slurry for patterned wafer edge polishing. We combine high stock removal and clean-ability with stability in a colloidal silica compound for mechanochemical polishing.


Edge Mirror V
This polishing slurry is most suitable for edge polishing of silicon wafers. We combine stability with a high removal rate by adoption of new colloidal silica to suppress wafers staining without severe pH control.


Pad (DRP) for Edge Polishing
DRP is a specially developed edge polishing pad for silicon wafers which is made with a cushion layer combined with an polishing layer. This pad enables high pressure, a high stock removal and long pad life for the lowest cost of ownership processing.


Lower Chuck Pad
Chuck pads protect silicon wafer surfaces from staining or damage during our edge polishing process.


Notch Pad
Our notch polish pads are shaped for suitability to most efficiently polish the insides the notches of silicon wafers.