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 Carriers for Double Side Processing |
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| Our lineup of work carriers for double side lapping and polishing are made of various materials such as Epoxy Glass, PVC, baked cloth, SK, blue steel, and stainless for efficient precision processing of various materials. |
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| Wedge Carriers (Insert Carriers) |
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| We line the work holding parts of strong metal carriers with strengthened resin to reduce damage to workpiece edges. With this combination of strong metal and the resinous materials high pressure and damage free processing is possible. |
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| Coated Carriers |
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| Our coated carriers prevent chipping of your fragile workpieces, and are SpeedFam originals. These carriers which are manufactured with highly precise techniques are lightweight and ideal for soft pad polishing processes. These carriers are coated with a thin epoxy resin over a precision stainless steel carrier and are most suitable for silicon wafers, compound semiconductor wafers, and glass polish processes. |
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| Carrier Thickness Measuring Instrument |
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| Our carrier thickness measuring instrument ensures uniform of measurements which are essential to corresponding workpiece flatness and roll-off. The data can be output to PC automatically to ensure high quality carrier thickness control reliably and easily. |
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