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2 October 2020

SEMICON Japan 2020 Virtual

In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our advanced solutions of surface creation in this SEMICON Japan.
Our exhibition will include:
  • Flattening system for prime silicon wafers
    For high-precision 300mm prime silicon wafer planarization, SpeedFam introduces the latest series of polisher and edge polisher as well as the most suitable consumables.
  • Solutions for LT/LN, sapphire and SiC wafers
    SpeedFam introduces its advanced systems for various material wafers including SiC, GaN, LT/LN, ultra-thin quartz crystal and sapphire.
  • Metrology systems
    We display edge/notch profile measurement system for sapphire wafer, etc.
SpeedFam exhibits the lineups which support up and coming demands for next generation productions.
Please be sure to visit us at this virtual exhibition.
Session: 14-17 December 2020
Meeting place: Online