Double Side Polisher/Lapper
SpeedFam double side machines support lap and polish of large-sized workpieces with carrier sizes from 30 inches to a small workpieces with carrier sizes of 2 inches. SpeedFam provides precision and productivity for a processing agenda compatible to all workpiece variations. The abundance of applications includes prime silicon wafers, magnetic disks of all materials, quartz wafers, ceramics etc. SpeedFam has accumulated the most extensive material process know-how from all industries.
Please refer to the various models and applications to meet your specific requirements. SpeedFam has more variations than those in this website. Please contact your local support for more information.
Equipment for bare silicon wafers
DSM28B-5L-4D
The 28B-5L/P is our double side lapper for 300mm wafers. At 15 pieces per batch it is ideal for mass production. This system includes the latest functions, including precision pressure plate load control and eddy current automatic thickness control, which is ideal for the best nanotopography.
DSM20B-5P-4D
The 20B-5P-4D is the latest specification for double side polishing of 300mm or 200mm wafers. With un-paralleled stability this system mass-produces 15 each 200mm wafers per batch, and 5 each 300mm wafers per batch. This is the ideal system for high flatness, low Nanotopography automation, maintenance and cost of ownership. The 20B05P-4D meets the most severe demands for precision and roll-off.
Equipment for general purposes
DSM30B-5L/P-V
The 30B-5L/P double side machine is an all purpose system with a carrier diameter of 30 inches. We are able to achieve superior flatness, parallelism and surface finish with our unique compact and low height structure. This large size workpiece system incorporates decades of production experience for ease of operation and low maintenance for the lowest operating cost.
DSM16B-5L/P-V
The DSM16B-5L/P-V is double side machine for all purposes with a carrier size of 16 inches. As a medium-sized system, the 16B covers a wide spectrum of processing applications. As a mass production tool for thin workpieces the 16B has unique performance and convenience characteristics.
DSM9B-5L/P-V
The DSM9B-5L/P-V is general-purpose double side machine with a carrier size of 9 inches. As a semi-medium size system the 9B machines are capable of processing a wide variety of small thin workpieces. The 9B is an advanced abrasive platform capable of achieving stable parallelism and flatness for small, thin, and brittle workpieces.
DSM2B-9L/P-V / DSM-3B-7L/P-V
This platform is host to carrier sizes of 2 or 3 inches, suitable in the laboratory. For extremely small and thin applications this tool is ideal to exceed standard processing limits. Crystal thicknesses in the range of 16 microns can be achieved with this tool.
