Flat Chaser

The SpeedFam Flat Chaser is a measurement system for the plate and the polishing pads used in CMP and double side processing (upper and lower). Quantitative measurements of the degree of flatness on these large surfaces are realized for effective and efficient quality control of your process.

UH-I-9100

Hard polishing equipment for removal of edge epi of epi-substrate, e.g. compound semiconductor substrate

• Wafer size: 2" to 8"
• Centering without contact

TH-3600

Thickness classification equipment before lapping

• Wafer size: 3" to 6"
• Suitable for thickness equalization of substrates for lapping process

UWT-150

UWT-150 inspects electric resistivity of substrate without contact (for InP).

• 2 cassettes (50 substrates) with automated conveyer
• Measurement data is saved as text file (CSV format)
• Substrate in a lot: 999 maximum

FX-1200WR

Wafer transfer robot for 2" to 12" wafer from low vacuum to high vacuum

• Double arms
• Wafer inverse function of upper arm
• RS-232C command, I/O command interface