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2 October 2023
SEMICON Japan 2023 (Tokyo Big Sight)
- In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our advanced solutions of surface creation in this SEMICON Japan.
- Our exhibition will include:
- Flattening system for prime silicon wafers
For high-precision 300mm prime silicon wafer planarization, SpeedFam introduces the latest series of polisher and edge polisher as well as the most suitable consumables. - Solutions for LT/LN, sapphire and SiC wafers
SpeedFam introduces its advanced systems for various material wafers including SiC, GaN, LT/LN, ultra-thin quartz crystal and sapphire. - Metrology systems
We display edge/notch profile measurement system for sapphire wafer, etc.
- Flattening system for prime silicon wafers
- SpeedFam exhibits the lineups which support up and coming demands for next generation productions.
Please be sure to visit us. - Session: 13-15 December 2023
- Meeting place: Tokyo Big Sight, Japan
- Booth No: 1838 (East Hall 1)
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