30 June 2005

Flat Chaser to efficiently measure flatness of lapping plates and polishing pads

The SpeedFam Flat Chaser quantitatively measures the flatness of the polishing pad in CMP device fabrication and in double side processing.  In just a few minutes, plate or pad shape can be measured and displayed for fast and easy process data collection.

Polishing pads and plates directly affect wafer processing.  The precision of processing is decided by transferring the degree of these flatness conditions to the workpiece.  The SpeedFam Flat Chaser enables the management of the pad shape and condition, which are indispensable for wafer flatness in the production environment.

For double side lapper and polisher, the SpeedFam Flat Chaser measurement function of the upper plate (and/or pad) is attached as an option.

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• Reference:
• SpeedFam
• sfinfo@speedfam.com