News Releases

HOME > News Releases > 2014.11.09

9 November 2014

SEMICON Japan 2014 (Tokyo Big Sight)

In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our advanced solutions of surface creation in this SEMICON Japan.
Our exhibition will include:
  • Flattening system for prime silicon wafers
    For high-precision 300mm and 450mm prime silicon wafer planarization, SpeedFam introduces the latest series of polisher and edge polisher as well as the most suitable consumables.
  • Solutions for sapphire and SiC wafers
    SpeedFam introduces its advanced systems for large size sapphire wafer and various material wafers including SiC, GaN and ultra-thin quartz crystal.
  • Dry Planarization Equipment
    Numerically controlled dry chemical planarization system (DCP) realizes fast and stable processing with ultra-precision for the next generation flatness specifications of MEMS and SOI wafers.
  • Edge metrology system
    Edge Profiler of Yuhi Technology Corp. enables efficient quality control and yield enhancement of edge grinding process by measurement of edge and notch profiles of sapphire wafer, etc.
SpeedFam exhibits the lineups which support up and coming demands for next generation productions.
Please be sure to visit us.
Session: 3-5 December 2014
Meeting place: Tokyo Big Sight, Japan
Booth No: 2171 (East 2)