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4 October 2015

SEMICON Japan 2015 (Tokyo Big Sight)

In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our advanced solutions of surface creation in this SEMICON Japan.
Our exhibition will include:
  • Flattening system for prime silicon wafers
    For high-precision 300mm prime silicon wafer planarization, SpeedFam introduces the latest series of polisher and edge polisher as well as the most suitable consumables.
  • Solutions for LT/LN, sapphire and SiC wafers
    SpeedFam introduces its advanced systems for large size sapphire wafer and various material wafers including SiC, GaN, LT/LN and ultra-thin quartz crystal.
  • Dry Planarization Equipment
    Numerically controlled dry chemical planarization system (DCP) realizes fast and stable processing with ultra-precision for the next generation flatness specifications of MEMS and SOI wafers.
  • Metrology systems
    We display precise and high-speed thickness distribution measurement system for SOI wafer, etc. as well as edge/notch profile measurement system for sapphire wafer, etc.
SpeedFam exhibits the lineups which support up and coming demands for next generation productions.
Please be sure to visit us.
Session: 16-18 December 2015
Meeting place: Tokyo Big Sight, Japan
Booth No: 2921 (East 1-3H)