7 October 2022

SEMICON Japan 2022 (Tokyo Big Sight)

In order to meet the expectations of our customers, SpeedFam continues to develop original equipment and consumables as a pioneer of planar abrasion system. We will exhibit our advanced solutions of surface creation in this SEMICON Japan.

Our exhibition will include:

• Flattening system for prime silicon wafers
  For high-precision 300mm prime silicon wafer planarization, SpeedFam introduces the latest series of polisher and edge polisher as well as the most suitable consumables.
• Solutions for LT/LN, sapphire and SiC wafers
  SpeedFam introduces its advanced systems for various material wafers including SiC, GaN, LT/LN, ultra-thin quartz crystal and sapphire.
• Metrology systems
  We display edge/notch profile measurement system for sapphire wafer, etc.

SpeedFam exhibits the lineups which support up and coming demands for next generation productions.
Please be sure to visit us.

Session: 14-16 December 2022

Meeting place: Tokyo Big Sight, Japan

Booth No: 1441 (East Hall 1)

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• Reference:
• SpeedFam
• sfinfo@speedfam.com