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Edge Grinder

Edge Grinder is equipment to grind edge of all kinds of substrate materials for a specified profile. Our wide range of Edge Grinder lineup can support substrates of any material kind, such as silicon, metal, SiC, sapphire and oxide substrates, featuring easy operation and maintenance.

WIFG-300
WIFG-300

Edge grinder for 200mm to 300mm substrate, which provide high quality process in small footprint.

  1. 2 cassettes, C-to-C handling
  2. Suitable for silicon wafer by in-feed edge grinding with high quality process (#3000)
UH-I-8100/UH-I-8800
UH-I-8100 / UH-I-8800

Edge grinder for 4" to 8" substrate, which enables accurate direction of orientation flat. UH-I-8800 is a high throughput model by 2 axes of grinding wheels.

  1. 2 cassettes, C-to-C handling
  2. UH-I-8800 is high performance model with 2 axes grinding wheels, while UH-I-8100 is a basic model with 1 axis grinding wheel.
UH-I-6600
UH-I-6600

High throughput edge grinder by 2 axes of grinding wheels for 3" to 6" substrate

  1. Shorter tact-time than that of UH-I-6200A series by 2 axes grinding wheels
  2. Edge chipping detection
  3. (MAX) loader 8 cassettes, unloader 8 cassettes + NG cassette
UH-I-6200A
UH-I-6200A

Edge grinder for 3" to 6" substrate for high throughput with high quality.

  1. Shorter tact-time than that of UH-I-4102 / UH-I-4101
  2. 4 or 8 cassettes, C-back-C handling
  3. With cleaner and dryer for post grinding
  4. Applicable for thin wafer about 200um
UH-I-4102 / UH-I-4101
UH-I-4102 / UH-I-4101

Edge grinder for substrate diameter from 3" to 6" or 2" to 4", which enables accurate direction of orientation flat.

  1. (UH-I-4102) For substrate from 3" to 6", max 8 cassettes
  2. (UH-I-4101) For substrate from 2" to 4", max 20 cassettes
  3. Suitable for substrate of Si, InP, GaAs, SiC, sapphire, LT, quartz crystal, LBO, MgO, etc.
  4. Accuracy of orientation flat: +/- 0.03°

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